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Data Sheet
ABSOLUTE MAXIMUM RATINGS
ADV7612
Table 3.
Parameter
DVDD to GND
PVDD to GND
DVDDIO to GND
CVDD to GND
TVDD to GND
Digital Inputs Voltage to GND
5 V Tolerant Digital Inputs to
GND 1
Digital Outputs Voltage to GND
XTALP, XTALN
SCL/SDA Data Pins to DVDDIO
Maximum Junction
Temperature (T J MAX )
Storage Temperature Range
Rating
2.2 V
2.2 V
4.0 V
2.2 V
4.0 V
GND ? 0.3 V to DVDDIO + 0.3 V
5.3 V
GND ? 0.3 V to DVDDIO + 0.3 V
?0.3 V to PVDD + 0.3 V
DVDDIO ? 0.3 V to DVDDIO +
3.6 V
125°C
?60°C to +150°C
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the ADV7612 , the
user is advised to turn off the unused sections of the part.
Due to the printed circuit board (PCB) metal variation and,
therefore, variation in PCB heat conductivity, the value of θ JA
may differ for various PCBs.
The most efficient measurement solution is obtained using the
package surface temperature to estimate the die temperature
because this eliminates the variance associated with the θ JA value.
The maximum junction temperature (T J MAX ) of 125°C must not be
exceeded. The following equation calculates the junction tempera-
ture using the measured package surface temperature and applies
only when no heat sink is used on the device under test (DUT):
T J = T S + ( Ψ JT × W TOTAL )
where:
The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL,
Infrared Reflow Soldering (20 sec) 260°C
1
DDCA_SDA, DDCB_SCL, and DDCB_SDA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
T S is the package surface temperature (°C).
Ψ JT = 0.3°C/W for the 100-lead LQFP_EP.
W TOTAL = ((PVDD × I PVDD ) + (0.05 × TVDD × I TVDD ) + (CVDD ×
I CVDD ) + (DVDD × I DVDD ) + (DVDDIO × I DVDDIO ))
where 0.05 is 5% of the TVDD power that is dissipated on the
part itself.
ESD CAUTION
maximum rating conditions for extended periods may affect
device reliability.
Rev. E | Page 7 of 20
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